Hi, I have been using the EPC2302 devices in paralllel and I have paralleled 6 layers of 3oz and the paralleling is doen through the via placed on the pads of the EPC2302 devices. I am struggling real time to simplify the circuit in order to do the thermal simulation. Is there any way that could be helpful in order to desig heat sink for my case as this is taking alot of time in FEA (ansys, solidworks) to complee the mesh and ends up giving an error. Any suggestion would be highly appreicated. Thanks
Hello,
for a first order thermal solution calculation you can use our GaN FET Thermal Calculator (epc-co.com).
It includes a heatsink calculator…