How can I provide enhanced cooling to the eGaN FETs?
The limiting factor for output power in most high-density converters is junction temperature, which prompts the need for more effective thermal design. The chip-scale packaging of eGaN also offers six-sided cooling, with effective heat extraction from the bottom, top, and sides of the die. A This high-performance thermal solution implemented to extend the output current capability of eGaN-based converters is presented in How2AppNote 012: How to Get More Power Out of a High-Density eGaN -Based Converter with a Heatsink.