How to obtain the chip area size of 200V series GaN devices,I‘m tring to extract the relationship between specific ON-resistance R′ ds(Udc) and blocking voltage
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Hello,
the die area of our devices is pretty straightforward to be obtained, since we either do not have a package (CSP = chip scal package products) or the die is exposed on top for the packaged parts. So, die size is reported in the machanical drawing.
Best regards