Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
At this time, EPC does not recommend using a water rinseable solder flux for the PbF devices. If a water rinseable flux is used, the eGaN device needs to be rinsed on all four sides to ensure proper flux removal. A tilted device can obstruct the flow of the rinse and cause flux to remain trapped under the die. For this reason, using a no rinse solder flux with low ionic content and then rinsing the no rinse flux is recommended. For more information, please see our assembly application note: Assembling eGaN FETs and Integrated Circuits.