|
About the Assembly and Layout category
|
|
0
|
22
|
February 3, 2022
|
|
Solder Mask Defined pads vs NSMD
|
|
2
|
66
|
May 10, 2022
|
|
I'm entertaining utilizing the EPC2206 in a new design. Please elaborate/clarify what is meant by "It is recommended to have on-Cu trace PCB vias" on page 6 of the data sheet
|
|
1
|
31
|
February 27, 2022
|
|
Do EPC GaN eFETs pads come pretinted with solder?
|
|
1
|
34
|
February 27, 2022
|
|
Should we be under-filling the GaN FETs for the lab asset?
|
|
1
|
27
|
February 27, 2022
|
|
What is the best way to remove the underfill from the GaNFET with out damaging the FET
|
|
1
|
31
|
February 27, 2022
|
|
What is the best way to remove a GAN FET off a PCB without damaging the FET?
|
|
1
|
29
|
February 27, 2022
|
|
Do we have to use heatsink above the GaN FET?
|
|
1
|
43
|
February 27, 2022
|
|
Are there recommendations for size of via hole in-pad for your GaN devices?
|
|
1
|
36
|
February 27, 2022
|
|
Do you recommend using underfill with your wafer level chipscale packages?
|
|
1
|
38
|
February 27, 2022
|
|
Why is the hard switching gate loop more critical than the GaN acting as a diode and risking induced turn on?
|
|
1
|
31
|
February 27, 2022
|
|
Can you mount the GaN FETs on both sides of the PCB?
|
|
1
|
32
|
February 27, 2022
|
|
I notice you put VIAs under CAP Pads. Is there any solder liability impact?
|
|
1
|
29
|
February 27, 2022
|
|
For 200V GaN, what is the recommended minimum distance between the top and inner layer?
|
|
1
|
39
|
February 27, 2022
|
|
How do we determine the power loop inductance?
|
|
1
|
32
|
February 27, 2022
|
|
How do you measure the VGS and the VDS when you use a very compact layout?
|
|
1
|
37
|
February 27, 2022
|
|
Why is it better to have the gate drive return to the inner layer with VIA than going to source on the lower FET directly with no VIA
|
|
1
|
32
|
February 27, 2022
|
|
What would you advise for high current designs, paralleling multiple FETs closer to each other or paralleling outputs of multiple separate half bridges with optimal layout per half bridge?
|
|
1
|
31
|
February 27, 2022
|
|
What would be the impact of putting the gate driver in the opposite layer as the FET?
|
|
1
|
30
|
February 27, 2022
|
|
Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
|
|
1
|
31
|
February 27, 2022
|
|
What is the copper layer thickness for power & ground layer? What is the formula for current calculations?
|
|
1
|
22
|
February 27, 2022
|
|
What are common issues EPC has encountered in PCB design and assembly?
|
|
1
|
30
|
February 27, 2022
|
|
How much pressure can be applied to the EPC die?
|
|
1
|
32
|
February 27, 2022
|
|
Do the EPC eGaN parts require under-fill during manufacturing?
|
|
1
|
24
|
February 27, 2022
|
|
Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
39
|
February 27, 2022
|
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
20
|
February 27, 2022
|
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
|
|
1
|
34
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
|
|
1
|
35
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
|
|
1
|
26
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
|
|
1
|
29
|
February 27, 2022
|