I'm entertaining utilizing the EPC2206 in a new design. Please elaborate/clarify what is meant by "It is recommended to have on-Cu trace PCB vias" on page 6 of the data sheet
|
|
1
|
595
|
February 27, 2022
|
Are there recommendations for size of via hole in-pad for your GaN devices?
|
|
1
|
424
|
February 27, 2022
|
I notice you put VIAs under CAP Pads. Is there any solder liability impact?
|
|
1
|
485
|
February 27, 2022
|
Why is it better to have the gate drive return to the inner layer with VIA than going to source on the lower FET directly with no VIA
|
|
1
|
425
|
February 27, 2022
|
Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
|
|
1
|
476
|
February 27, 2022
|
Can a via be placed directly under a bump?
|
|
1
|
574
|
February 27, 2022
|