I notice you put VIAs under CAP Pads. Is there any solder liability impact?

Designing with GaN FETs and ICs Assembly and Layout
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1

I notice you put VIAs under CAP Pads. Is there any solder liability impact?

2

Yes and no: When we do VIAs, inside a pad it is better then to do it via-in-pad-plated-over. Discuss with your manufacturer whether you put VIA inside of the pad (thickness desired) or outside of the pad.