Designing with GaN FETs and ICs Assembly and Layout
Topic | Replies | Views | Activity | |
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Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
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1 | 158 | February 27, 2022 |
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
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1 | 175 | February 27, 2022 |
What tacky flux can be used for assembling the EPC lead free (PbF) die?
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1 | 130 | February 27, 2022 |
What considerations need to be made in regard to stencil design?
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1 | 178 | February 27, 2022 |
What lead free (PbF) solder pastes has EPC used?
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1 | 135 | February 27, 2022 |
Can a via be placed directly under a bump?
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1 | 212 | February 27, 2022 |
What is the recommended reflow for EPC die?
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1 | 190 | February 27, 2022 |
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
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1 | 137 | February 27, 2022 |
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
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1 | 141 | February 27, 2022 |