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What would you advise for high current designs, paralleling multiple FETs closer to each other or paralleling outputs of multiple separate half bridges with optimal layout per half bridge?
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1
|
684
|
February 27, 2022
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What would be the impact of putting the gate driver in the opposite layer as the FET?
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1
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628
|
February 27, 2022
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Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
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1
|
668
|
February 27, 2022
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What is the copper layer thickness for power & ground layer? What is the formula for current calculations?
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1
|
677
|
February 27, 2022
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What are common issues EPC has encountered in PCB design and assembly?
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1
|
645
|
February 27, 2022
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Do the EPC eGaN parts require under-fill during manufacturing?
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1
|
877
|
February 27, 2022
|
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Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
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|
1
|
670
|
February 27, 2022
|
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What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
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|
1
|
735
|
February 27, 2022
|
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What tacky flux can be used for assembling the EPC lead free (PbF) die?
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1
|
462
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
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1
|
718
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
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1
|
712
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
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|
1
|
1028
|
February 27, 2022
|
|
What is the recommended reflow for EPC die?
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|
1
|
815
|
February 27, 2022
|
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
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|
1
|
549
|
February 27, 2022
|
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How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
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|
1
|
661
|
February 27, 2022
|