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Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
|
|
1
|
515
|
February 27, 2022
|
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What is the copper layer thickness for power & ground layer? What is the formula for current calculations?
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|
1
|
506
|
February 27, 2022
|
|
What are common issues EPC has encountered in PCB design and assembly?
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1
|
432
|
February 27, 2022
|
|
Do the EPC eGaN parts require under-fill during manufacturing?
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|
1
|
689
|
February 27, 2022
|
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Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
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1
|
511
|
February 27, 2022
|
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
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|
1
|
532
|
February 27, 2022
|
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
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|
1
|
327
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
|
|
1
|
548
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
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1
|
446
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
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|
1
|
715
|
February 27, 2022
|
|
What is the recommended reflow for EPC die?
|
|
1
|
513
|
February 27, 2022
|
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
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|
1
|
417
|
February 27, 2022
|
|
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
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|
1
|
461
|
February 27, 2022
|