Designing with GaN FETs and ICs Assembly and Layout
| Topic | Replies | Views | Activity | |
|---|---|---|---|---|
|
Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
|
|
1 | 158 | February 27, 2022 |
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
|
|
1 | 175 | February 27, 2022 |
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
|
|
1 | 130 | February 27, 2022 |
|
What considerations need to be made in regard to stencil design?
|
|
1 | 178 | February 27, 2022 |
|
What lead free (PbF) solder pastes has EPC used?
|
|
1 | 135 | February 27, 2022 |
|
Can a via be placed directly under a bump?
|
|
1 | 212 | February 27, 2022 |
|
What is the recommended reflow for EPC die?
|
|
1 | 190 | February 27, 2022 |
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
|
|
1 | 137 | February 27, 2022 |
|
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
|
|
1 | 141 | February 27, 2022 |