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Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
|
|
1
|
565
|
February 27, 2022
|
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What is the copper layer thickness for power & ground layer? What is the formula for current calculations?
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|
1
|
564
|
February 27, 2022
|
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What are common issues EPC has encountered in PCB design and assembly?
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1
|
496
|
February 27, 2022
|
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Do the EPC eGaN parts require under-fill during manufacturing?
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1
|
754
|
February 27, 2022
|
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Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
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1
|
560
|
February 27, 2022
|
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What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
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|
1
|
594
|
February 27, 2022
|
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
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1
|
373
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
|
|
1
|
630
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
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|
1
|
544
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
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|
1
|
804
|
February 27, 2022
|
|
What is the recommended reflow for EPC die?
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|
1
|
611
|
February 27, 2022
|
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
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|
1
|
468
|
February 27, 2022
|
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How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
|
|
1
|
540
|
February 27, 2022
|