What are common issues EPC has encountered in PCB design and assembly?
|
|
1
|
248
|
February 27, 2022
|
Do the EPC eGaN parts require under-fill during manufacturing?
|
|
1
|
300
|
February 27, 2022
|
Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
225
|
February 27, 2022
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
248
|
February 27, 2022
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
|
|
1
|
181
|
February 27, 2022
|
What considerations need to be made in regard to stencil design?
|
|
1
|
311
|
February 27, 2022
|
What lead free (PbF) solder pastes has EPC used?
|
|
1
|
203
|
February 27, 2022
|
Can a via be placed directly under a bump?
|
|
1
|
341
|
February 27, 2022
|
What is the recommended reflow for EPC die?
|
|
1
|
250
|
February 27, 2022
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
|
|
1
|
205
|
February 27, 2022
|
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
|
|
1
|
212
|
February 27, 2022
|