What considerations need to be made in regard to stencil design?
A laser-cut stainless steel stencil of 100-µm thickness is recommended. A smooth wall laser-cut stencil is more likely to release the desired dispense volume. Type 3 solder paste requires a larger opening than Type 4 solder, and recommendations are available for both in Assembling eGaN FETs and Integrated Circuits application note. In the case that a stamped stencil must be used, it may be necessary to enlarge the opening slightly to compensate for proper solder release volume.