How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?

Designing with GaN FETs and ICs Assembly and Layout
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How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?

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eGan devices can be assembled easily like any other Land Grid Array (LGA) device. Users can generally apply standard surface mount techniques to successfully attach EPC’s eGaN FETs onto standard PCBs. EPC has published an application note as well as quick-start guides for die attach and die removal. These can be found on the Assembly Resources page.

All EPC eGaN devices are MSL-1 rated.