What is the recommended reflow for EPC die?
The typical reflow profile is shown on page five of Application Note 009: Assembling eGaN FETs and Integrated Circuits. General guidance for reflow is to stay above liquidus temperature for 45-90 seconds. EPC recommends a minimum of 60 sec. The temperature for liquidus will vary with solder ball/bump composition. For example:
EPC2045 Liquidus for solder ball 217 °C
EPC2214 Liquidus for solder bump 223 °C
