Do the EPC eGaN parts require under-fill during manufacturing?

Do the EPC eGaN parts require under-fill during manufacturing?

Underfill should be used in applications where the board is exposed to moisture. Moisture and other contaminants may provide an environment that allows dendrite growth. For 150ºC-capable EPC devices, some available underfills are Hysol FP4531 and AI Technology MC7685-UFS.