Do the EPC eGaN parts require under-fill during manufacturing?

Designing with GaN FETs and ICs Assembly and Layout
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Do the EPC eGaN parts require under-fill during manufacturing?

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Underfill should be used in applications where the board is exposed to moisture. Moisture and other contaminants may provide an environment that allows dendrite growth. For 150ºC-capable EPC devices, some available underfills are Hysol FP4531 and AI Technology MC7685-UFS.