What is the best way to remove a GAN FET off a PCB without damaging the FET?
Removing the GaN FET is the same as removing a MOSFET in terms of heat using hot air systems. Remember that Like Power MOSFETS, EPC FETs are connected to large copper power planes or fat traces which conduct heat away. So it will take a lot of heat. Typically one preheat the board to close but just below the solder temperature melting point. Then use a narrow hot air nozzle gun to heat just the FET itself to the reflow point allowing you to use tweezers to pick up the FET. Do not let the metal nozzle touch the FET or the board. To minimize damage to the FET and any other GaN FETs nearby, we recommend you use high temperature plastic tweezers. They make some that can survive soldering temps allowing you to pick up the part and remove it without damaging it. The key is NOT to use anything metal tool for it will cause the FET you removing to crack or worse damage adjacent good GaN FETs you want to keep. For more information see the Quick Reference - Die Removal Procedure and the video resource Assembly Demonstration - Die Removal