How much pressure can be applied to the EPC die?
Please note that the below response applies to the following LGA package devices: EPC2001C, EPC2007C, EPC2010C, EPC2012C, EPC2014C, EPC2015C, EPC2016C, EPC2019, EPC8002, EPC8004, EPC8009 and EPC8010.
EPC has determined that the die in the list above can withstand up to 200 psi without adverse effect to the die parametric performance. It is important to note that this number assumes there is not a severe assembly issue (i.e. die tilt) that could affect the attachment of the heat sink material and/or the uniformity of applied pressure.