Designing with GaN FETs and ICs
| Topic | Replies | Views | Activity | |
|---|---|---|---|---|
| What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs? |
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1 | 593 | February 27, 2022 |
| What tacky flux can be used for assembling the EPC lead free (PbF) die? |
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1 | 370 | February 27, 2022 |
| What considerations need to be made in regard to stencil design? |
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1 | 630 | February 27, 2022 |
| What lead free (PbF) solder pastes has EPC used? |
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1 | 542 | February 27, 2022 |
| Can a via be placed directly under a bump? |
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1 | 797 | February 27, 2022 |
| What is the recommended reflow for EPC die? |
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1 | 602 | February 27, 2022 |
| What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die? |
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1 | 467 | February 27, 2022 |
| How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process? |
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1 | 539 | February 27, 2022 |