|
What are common issues EPC has encountered in PCB design and assembly?
|
|
1
|
578
|
February 27, 2022
|
|
Do the EPC eGaN parts require under-fill during manufacturing?
|
|
1
|
809
|
February 27, 2022
|
|
Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
611
|
February 27, 2022
|
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
654
|
February 27, 2022
|
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
|
|
1
|
415
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
|
|
1
|
673
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
|
|
1
|
629
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
|
|
1
|
915
|
February 27, 2022
|
|
What is the recommended reflow for EPC die?
|
|
1
|
710
|
February 27, 2022
|
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
|
|
1
|
506
|
February 27, 2022
|
|
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
|
|
1
|
586
|
February 27, 2022
|