Designing with GaN FETs and ICs
| Topic | Replies | Views | Activity | |
|---|---|---|---|---|
| Can a via be placed directly under a bump? |
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1 | 748 | February 27, 2022 |
| What is the recommended reflow for EPC die? |
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1 | 547 | February 27, 2022 |
| What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die? |
|
1 | 435 | February 27, 2022 |
| How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process? |
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1 | 497 | February 27, 2022 |