|
Is C bypass Hi FET @ low FET ground the best way to optimize loop inductance?
|
|
1
|
586
|
February 27, 2022
|
|
What is the copper layer thickness for power & ground layer? What is the formula for current calculations?
|
|
1
|
583
|
February 27, 2022
|
|
What is the best method to remove heat from a 2 kilowatt isolated DC-DC @ 48 V unregulated full bridge?
|
|
1
|
728
|
February 27, 2022
|
|
What are common issues EPC has encountered in PCB design and assembly?
|
|
1
|
523
|
February 27, 2022
|
|
Do the EPC eGaN parts require under-fill during manufacturing?
|
|
1
|
775
|
February 27, 2022
|
|
Can a water rinseable solder flux be used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
571
|
February 27, 2022
|
|
What does EPC recommend for solder flux being used in assembling lead free (PbF) eGaN FETs?
|
|
1
|
617
|
February 27, 2022
|
|
What tacky flux can be used for assembling the EPC lead free (PbF) die?
|
|
1
|
392
|
February 27, 2022
|
|
What considerations need to be made in regard to stencil design?
|
|
1
|
647
|
February 27, 2022
|
|
What lead free (PbF) solder pastes has EPC used?
|
|
1
|
572
|
February 27, 2022
|
|
Can a via be placed directly under a bump?
|
|
1
|
834
|
February 27, 2022
|
|
What is the recommended reflow for EPC die?
|
|
1
|
655
|
February 27, 2022
|
|
What is the composition of the lead free (PbF) solder bump and underbump (UBM) metals for EPC die?
|
|
1
|
485
|
February 27, 2022
|
|
How do I assemble EPC’s enhancement mode GaN devices and do these parts require any special steps during the manufacturing process?
|
|
1
|
561
|
February 27, 2022
|
|
Are GaN FETs prone to small area overheating?
|
|
1
|
690
|
February 27, 2022
|
|
Is there an optimum or recommended junction temperature for EPC2045?
|
|
1
|
809
|
February 27, 2022
|
|
Do EPC GaN FETs require a negative gate drive voltage?
|
|
1
|
1353
|
February 27, 2022
|
|
What is the longest short circuit time for GaN devices?
|
|
1
|
643
|
February 27, 2022
|
|
Can EPC GaN FETs (with packaging or not) have a working temperature between 250°C-300°C
|
|
1
|
562
|
February 27, 2022
|
|
Do I need a parallel external diode for reverse diode protection?
|
|
1
|
1321
|
February 27, 2022
|
|
Is there is an internal diode protecting the VGS?
|
|
1
|
924
|
February 27, 2022
|
|
For the EPC device maximum range of Vgs is from -4 V ~ 6 V, is this range a continuous value or transient value?
|
|
1
|
781
|
February 27, 2022
|
|
Where can I get a materials declaration sheet for your products?
|
|
1
|
585
|
February 27, 2022
|
|
What are the limitations on the gate input for EPC’s eGaN devices?
|
|
1
|
669
|
February 14, 2022
|
|
How do I lay out the eGaN devices in my high-performance power conversion circuit?
|
|
1
|
614
|
February 14, 2022
|
|
Does the GaN have a body diode? If so how does it compare with the Silicon MOSFETs with respect to forward voltage drop and reverse recovery characteristics?
|
|
1
|
4572
|
February 14, 2022
|
|
How does the "body diode" forward drop change if the gate is driven to a negative voltage?
|
|
1
|
965
|
February 14, 2022
|
|
How do I test EPC’s enhancement mode GaN devices?
|
|
1
|
550
|
February 14, 2022
|
|
What is the temperature range for extended application?
|
|
1
|
641
|
February 14, 2022
|
|
What is the temperature dependence of Gate-Source Threshold?
|
|
1
|
634
|
February 14, 2022
|