Wafer level chip scale assembly considerations
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|
1
|
435
|
March 16, 2023
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Thermal management and heat sink options
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1
|
491
|
March 7, 2023
|
GaN motor drive inverters and torque
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1
|
410
|
March 7, 2023
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PCB with full-bridge EPC2021 and LM5113 driver, oscillation problems arise
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3
|
745
|
March 7, 2023
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CURRENT SENSING FOR 1MHz SWITCHING
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1
|
650
|
March 2, 2023
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Oszillations in phase shifted bridge
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1
|
401
|
February 28, 2023
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TI's LM5177 with EPC2071 design support
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|
5
|
1088
|
February 20, 2023
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EPC90124 maximum voltage
|
|
1
|
437
|
February 14, 2023
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Characteristics of Integrated drivers
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1
|
378
|
February 10, 2023
|
Integration benefits
|
|
1
|
473
|
February 10, 2023
|
Derating methodology
|
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1
|
498
|
February 10, 2023
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ENGRT suffix meaning?
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1
|
433
|
February 10, 2023
|
Efficiency trade offs and available models
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|
1
|
529
|
February 10, 2023
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Transconductance Value calculation
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1
|
501
|
February 10, 2023
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GaN FET symbol clarification
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|
1
|
506
|
February 10, 2023
|
Dead time requirements in a motor drive
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1
|
483
|
February 9, 2023
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SOA data clarification
|
|
1
|
433
|
February 9, 2023
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GaN's anti-parallel intrinsic diode
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|
1
|
611
|
February 9, 2023
|
Switching characteristics of GaN
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|
2
|
512
|
February 9, 2023
|
PSpice or SIMetrix EPC2014C
|
|
2
|
776
|
January 23, 2023
|
EPC Cross Reference Calculator
|
|
6
|
560
|
January 18, 2023
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Isolation for 48V PoL in data center
|
|
1
|
591
|
January 10, 2023
|
EPC2212 for LIDAR
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|
1
|
840
|
December 29, 2022
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EPC2152_sim not working
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|
4
|
396
|
December 13, 2022
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Question about Crosstalk in boost circuit
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2
|
336
|
December 13, 2022
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EPC2218 solder bump melting
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|
5
|
607
|
December 6, 2022
|
Pin designation on GaN driver UP1966E
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|
3
|
392
|
December 2, 2022
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How to connect 2 epc 9078 to make full bridge
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1
|
377
|
November 29, 2022
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What are the theoretical temp limits for GaN devices?
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|
2
|
529
|
November 28, 2022
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Temperature rising within 1ms with EPC2023 at 60A, Vgs = 2.577V, Rds_on = 14.6mOhm
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|
3
|
487
|
November 23, 2022
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