Assembly question
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|
1
|
640
|
March 16, 2023
|
Wafer level chip scale assembly considerations
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1
|
678
|
March 16, 2023
|
Thermal management and heat sink options
|
|
1
|
724
|
March 7, 2023
|
GaN motor drive inverters and torque
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1
|
573
|
March 7, 2023
|
PCB with full-bridge EPC2021 and LM5113 driver, oscillation problems arise
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3
|
1139
|
March 7, 2023
|
CURRENT SENSING FOR 1MHz SWITCHING
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1
|
875
|
March 2, 2023
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Oszillations in phase shifted bridge
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1
|
532
|
February 28, 2023
|
TI's LM5177 with EPC2071 design support
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5
|
1736
|
February 20, 2023
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EPC90124 maximum voltage
|
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1
|
608
|
February 14, 2023
|
Characteristics of Integrated drivers
|
|
1
|
501
|
February 10, 2023
|
Integration benefits
|
|
1
|
623
|
February 10, 2023
|
Derating methodology
|
|
1
|
795
|
February 10, 2023
|
ENGRT suffix meaning?
|
|
1
|
617
|
February 10, 2023
|
Efficiency trade offs and available models
|
|
1
|
650
|
February 10, 2023
|
Transconductance Value calculation
|
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1
|
832
|
February 10, 2023
|
GaN FET symbol clarification
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1
|
815
|
February 10, 2023
|
Dead time requirements in a motor drive
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|
1
|
696
|
February 9, 2023
|
SOA data clarification
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1
|
648
|
February 9, 2023
|
GaN's anti-parallel intrinsic diode
|
|
1
|
1085
|
February 9, 2023
|
Switching characteristics of GaN
|
|
2
|
761
|
February 9, 2023
|
PSpice or SIMetrix EPC2014C
|
|
2
|
1066
|
January 23, 2023
|
EPC Cross Reference Calculator
|
|
6
|
759
|
January 18, 2023
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Isolation for 48V PoL in data center
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|
1
|
877
|
January 10, 2023
|
EPC2212 for LIDAR
|
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1
|
1058
|
December 29, 2022
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EPC2152_sim not working
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4
|
550
|
December 13, 2022
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Question about Crosstalk in boost circuit
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2
|
484
|
December 13, 2022
|
EPC2218 solder bump melting
|
|
5
|
813
|
December 6, 2022
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Pin designation on GaN driver UP1966E
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|
3
|
510
|
December 2, 2022
|
How to connect 2 epc 9078 to make full bridge
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|
1
|
527
|
November 29, 2022
|
What are the theoretical temp limits for GaN devices?
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|
2
|
829
|
November 28, 2022
|